Model Number |
H.C.C PCB080326001 |
8-layers
FR4 Tg170
finished board thickness:1.6mm
finished copper thickness:1oz
surface treatment: Flash gold
solder mask: green
silkscreen: white
Min through hole:0.1mm(4mil)
Min line width: 0.075mm(3mil)
Min line space:0.1mm(4mil)
special requirement: blind via + buired via + controlled impedance
Package: vacuum seal package
MOQ:5pcs
Payment term: T/T,L/C,D/P
FOB Shenzhen
Quick turn:8-10wds
Capacity:30000sqm/month
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